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Automated Optical Measurement System
Focus-5000GX


■ PCB size up to 510x460mm
■ High accuracy XY robot
■ Conveyor embedded
■ High resolution
■ Larger field view
■ 3M pixel digital camera
■ Multi-angle dome LED array
■ PWM brightness control
■ Auto-programming


Specification


  Vision Input Unit
  Camera
High resolution color 3Mega pixel
  Lighting Source
Multi-angle LED dome with PWM brightness control
  Image Resolution
15.6μm/pixel
  Frame Extent
32mm X 24mm
  Measurement and Diagnoses
MultiMetric™ Image analyses method
  Inspectable PCBs
  Solder Process
Reflow or wave solder
  Size
Maximum: 510 x 460 mm 
Minimum: 50 x 50 mm
  Thickness
0.5 to 2.5 mm
  Clearance
Top 24mm   Bottom 20mm
  Warp
Within 1mm
  Measurement and Inspection
  Inspectable Component
Chips 0603 and up, LSI 0.3mm pitch and up, through-hole components
  Component Placement
Presence/Absence, XYӨ offset, wrong component, Component Orientation, Lifted leads
  Solder
Solder bridges, insufficient solder, excess solder, wettability, through hole pins, dropped parts and solder
  Speed
About 380ms/frame
  XY  Robot
  Maximum Speed
500 mm/s
  Repeatable Accuracy
10 μm
  Conveyor System
  Transportation
Belt
  PCB Level
900(+/-)10mm
  PCB Fixed Method
Clamped at rear side
  Direction
Right-Left, Left-Right, Right-Right, Left-Left, Bypass
  Rail Width Adjustment
By wheel handle
  Interface
Support SMEMA 1.2
  Computer Related
  P C
DOSV PC Windows XP Professional
CPU: Dual core RAM 2GB, HDD 350GB or up
  Language
Japanese / English
  Programming
  Procedures
1. Read the CAD data or Mount data text file to get Part
    name,
XYӨ, and package, rotation information
2. Using camera auto route tools to set optimal route
3. Verify the coordinate data at the machine
4. Selecting suitable decision limit value.
    Training and fine tuning
  Library
Standard component package library or use package library editor to create customized library
  Others
Offline programming supported, multi panels PCB support, top and bottom side inspection at one project file
  Defects Result
  Defects Detail Output
Contents: Part name, defect location, defect image, etc. Method: Iin file or page print.
  Inspection Result Logging
Configurable
  Defect Review
Show the full PCB map, defects images and location, etc
  SPC Tools
  SPC
Statistics of part shift, solder quality value at Cpk, Xbar, and histogram
  Process Warning
Warnings : The measurement value is close to the defect level. The measurement value is far away from regular value trend.
  Facilities and Factory Integration
  Dimensions

W1100 x D1000 x H1600mm
(Height of signal tower is not included)

  Power Requirement
100V single phase  50Hz/60Hz 10A Available for assigning others when PO.
  Air
0.4 to 0.6Mpa
  Working Temperature
10 - 35℃
  Humidity
30 - 80% RH
  Options
  OP01 Offline Software
For programming, result display at rework station and statistics report confirmation
  OP02 OCR
For board and component top characters recognition
  OP03 Barcode Reader
Barcode reader for project switching
  OP04 Stamper Mechanics
GO/NG stamper
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